Engineered Nanostructures for High Thermal Conductivity Substrates

Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Bibliographic Details
Main Authors: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Other Authors: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Article
Language:en_US
Published: Nano Science and Technology Institute 2011
Online Access:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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