Engineered Nanostructures for High Thermal Conductivity Substrates

Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Detalhes bibliográficos
Principais autores: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Outros Autores: Massachusetts Institute of Technology. Department of Mechanical Engineering
Formato: Artigo
Idioma:en_US
Publicado em: Nano Science and Technology Institute 2011
Acesso em linha:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

Internet

http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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