Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Библиографические подробности
Главные авторы: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Другие авторы: Massachusetts Institute of Technology. Department of Mechanical Engineering
Формат: Статья
Язык:en_US
Опубликовано: Nano Science and Technology Institute 2011
Online-ссылка:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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