Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Номзүйн дэлгэрэнгүй
Үндсэн зохиолчид: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Бусад зохиолчид: Massachusetts Institute of Technology. Department of Mechanical Engineering
Формат: Өгүүллэг
Хэл сонгох:en_US
Хэвлэсэн: Nano Science and Technology Institute 2011
Онлайн хандалт:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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