Engineered Nanostructures for High Thermal Conductivity Substrates
In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...
Main Authors: | Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk |
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Drugi avtorji: | Massachusetts Institute of Technology. Department of Mechanical Engineering |
Format: | Article |
Jezik: | en_US |
Izdano: |
Nano Science and Technology Institute
2011
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Online dostop: | http://hdl.handle.net/1721.1/64411 https://orcid.org/0000-0002-6846-152X |
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