Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Bibliografske podrobnosti
Main Authors: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Drugi avtorji: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Article
Jezik:en_US
Izdano: Nano Science and Technology Institute 2011
Online dostop:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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