Engineered Nanostructures for High Thermal Conductivity Substrates
In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...
| Autores principales: | , , , , , , , , , , , , , |
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| Otros Autores: | |
| Formato: | Artículo |
| Lenguaje: | en_US |
| Publicado: |
Nano Science and Technology Institute
2011
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| Acceso en línea: | http://hdl.handle.net/1721.1/64411 https://orcid.org/0000-0002-6846-152X |