Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

Szczegółowa specyfikacja

Opis bibliograficzny
Główni autorzy: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Kolejni autorzy: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Artykuł
Język:en_US
Wydane: Nano Science and Technology Institute 2011
Dostęp online:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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