Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Bibliografski detalji
Glavni autori: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Daljnji autori: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Članak
Jezik:en_US
Izdano: Nano Science and Technology Institute 2011
Online pristup:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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