Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Xehetasun bibliografikoak
Egile Nagusiak: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Beste egile batzuk: Massachusetts Institute of Technology. Department of Mechanical Engineering
Formatua: Artikulua
Hizkuntza:en_US
Argitaratua: Nano Science and Technology Institute 2011
Sarrera elektronikoa:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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