Engineered Nanostructures for High Thermal Conductivity Substrates

Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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מידע ביבליוגרפי
Main Authors: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
מחברים אחרים: Massachusetts Institute of Technology. Department of Mechanical Engineering
פורמט: Article
שפה:en_US
יצא לאור: Nano Science and Technology Institute 2011
גישה מקוונת:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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