Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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Váldodahkkit: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
Eará dahkkit: Massachusetts Institute of Technology. Department of Mechanical Engineering
Materiálatiipa: Artihkal
Giella:en_US
Almmustuhtton: Nano Science and Technology Institute 2011
Liŋkkat:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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