Engineered Nanostructures for High Thermal Conductivity Substrates
In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...
Váldodahkkit: | Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk |
---|---|
Eará dahkkit: | Massachusetts Institute of Technology. Department of Mechanical Engineering |
Materiálatiipa: | Artihkal |
Giella: | en_US |
Almmustuhtton: |
Nano Science and Technology Institute
2011
|
Liŋkkat: | http://hdl.handle.net/1721.1/64411 https://orcid.org/0000-0002-6846-152X |
Geahča maid
-
On the charging and thermal characterization of a micro/nano structured thermal ground plane
Dahkki: de Bock, H. Peter J., et al.
Almmustuhtton: (2012) -
Vibration damping using low-wave-speed media with applications to precision machines
Dahkki: Varanasi, Kripa K. (Kripa Kiran), 1977-
Almmustuhtton: (2006) -
On the design of a precision machine for closed-loop performance
Dahkki: Varanasi, Kripa K. (Kripa Kiran), 1977-
Almmustuhtton: (2014) -
Expansion and retraction dynamics in drop-on-drop impacts on nonwetting surfaces
Dahkki: Damak, Maher, et al.
Almmustuhtton: (2018) -
Electrostatically driven fog collection using space charge injection
Dahkki: Damak, Maher, et al.
Almmustuhtton: (2018)