Engineered Nanostructures for High Thermal Conductivity Substrates

In the DARPA Thermal Ground Plane (TGP) program[1],we are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. The proposed TGP is a planar, thermal e...

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书目详细资料
Main Authors: Varanasi, Kripa K., Chamarthy, Pramod, Chauhan, Shakti, de Bock, Peter, Deng, Tao, Kulkarni, Ambarish, Mandrusiak, Gary, Rush, Brian, Russ, Boris, Denault, Lauraine, Weaver, Stanton, Gerner, Frank M., Leland, Quinn, Yerkes, Kirk
其他作者: Massachusetts Institute of Technology. Department of Mechanical Engineering
格式: 文件
语言:en_US
出版: Nano Science and Technology Institute 2011
在线阅读:http://hdl.handle.net/1721.1/64411
https://orcid.org/0000-0002-6846-152X

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