The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces

Atomistic modeling shows that Cu–Nb and Cu–V interfaces contain high excess atomic volume due to constitutional vacancy concentrations of ∼ 5 at. % and ∼ 0.8 at. %., respectively. This finding is supported by experiments demonstrating that an approximately fivefold higher He concentration is require...

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Main Authors: Demkowicz, Michael J., Usov, I., Bhattacharyya, D., Wang, Y. Q., Nastasi, M., Misra, Amit
Other Authors: Massachusetts Institute of Technology. Department of Materials Science and Engineering
Format: Article
Language:en_US
Published: American Institute of Physics 2012
Online Access:http://hdl.handle.net/1721.1/69035
https://orcid.org/0000-0003-3949-0441
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author Demkowicz, Michael J.
Usov, I.
Bhattacharyya, D.
Wang, Y. Q.
Nastasi, M.
Misra, Amit
author2 Massachusetts Institute of Technology. Department of Materials Science and Engineering
author_facet Massachusetts Institute of Technology. Department of Materials Science and Engineering
Demkowicz, Michael J.
Usov, I.
Bhattacharyya, D.
Wang, Y. Q.
Nastasi, M.
Misra, Amit
author_sort Demkowicz, Michael J.
collection MIT
description Atomistic modeling shows that Cu–Nb and Cu–V interfaces contain high excess atomic volume due to constitutional vacancy concentrations of ∼ 5 at. % and ∼ 0.8 at. %., respectively. This finding is supported by experiments demonstrating that an approximately fivefold higher He concentration is required to observe He bubbles via through-focus transmission electron microscopy at Cu–Nb interfaces than in Cu–V interfaces. Interfaces with structures tailored to minimize precipitation and growth of He bubbles may be used to design damage-resistant composites for fusion reactors.
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spelling mit-1721.1/690352022-10-03T08:15:35Z The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces Demkowicz, Michael J. Usov, I. Bhattacharyya, D. Wang, Y. Q. Nastasi, M. Misra, Amit Massachusetts Institute of Technology. Department of Materials Science and Engineering Demkowicz, Michael J. Demkowicz, Michael J. Atomistic modeling shows that Cu–Nb and Cu–V interfaces contain high excess atomic volume due to constitutional vacancy concentrations of ∼ 5 at. % and ∼ 0.8 at. %., respectively. This finding is supported by experiments demonstrating that an approximately fivefold higher He concentration is required to observe He bubbles via through-focus transmission electron microscopy at Cu–Nb interfaces than in Cu–V interfaces. Interfaces with structures tailored to minimize precipitation and growth of He bubbles may be used to design damage-resistant composites for fusion reactors. United States. Dept. of Energy. Office of Basic Energy Sciences (award 2008LANL1026) 2012-02-07T20:54:31Z 2012-02-07T20:54:31Z 2010-10 2010-08 Article http://purl.org/eprint/type/JournalArticle 0003-6951 1077-3118 http://hdl.handle.net/1721.1/69035 Demkowicz, M. J. et al. “The effect of excess atomic volume on He bubble formation at fcc–bcc interfaces.” Applied Physics Letters 97.16 (2010): 161903. https://orcid.org/0000-0003-3949-0441 en_US http://dx.doi.org/10.1063/1.3502594 Applied Physics Letters Creative Commons Attribution-Noncommercial-Share Alike 3.0 http://creativecommons.org/licenses/by-nc-sa/3.0/ application/pdf American Institute of Physics Prof. Demkowicz
spellingShingle Demkowicz, Michael J.
Usov, I.
Bhattacharyya, D.
Wang, Y. Q.
Nastasi, M.
Misra, Amit
The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces
title The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces
title_full The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces
title_fullStr The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces
title_full_unstemmed The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces
title_short The effect of excess atomic volume on He bubble formation at fcc-bcc interfaces
title_sort effect of excess atomic volume on he bubble formation at fcc bcc interfaces
url http://hdl.handle.net/1721.1/69035
https://orcid.org/0000-0003-3949-0441
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