Root cause analysis of solder flux residue incidence in the manufacture of electronic power modules

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.

Bibliographic Details
Main Author:	Jain, Pranav
Other Authors:	Jung-Hoon Chun.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2012
Subjects:	Mechanical Engineering.
Online Access:	http://hdl.handle.net/1721.1/69489

Internet

http://hdl.handle.net/1721.1/69489