Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model

Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model

Chemical mechanical planarization (CMP) pad stiffness and conditioning effects were evaluated based on a physical die-level CMP model, with pad effective modulus and asperity height as parameters. In one study, patterned dielectric wafers were polished using polymeric pads of different stiffnesses....

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Bibliographic Details
Main Authors: Boning, Duane S., Fan, Wei, Charns, Leslie, Miyauchi, Hiroyuki, Tano, Hiroyuki, Tsuji, Shoei
Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Format: Article
Language:en_US
Published: Electrochemical Society 2012
Online Access:http://hdl.handle.net/1721.1/71165
https://orcid.org/0000-0002-0417-445X

Internet

http://hdl.handle.net/1721.1/71165
https://orcid.org/0000-0002-0417-445X

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