On the charging and thermal characterization of a micro/nano structured thermal ground plane
As power densities in electronic devices have increased dramatically over the last decade, advanced thermal management solutions are required. A significant part of the thermal resistance budget is commonly taken up by the heat spreader, which serves to reduce the input heat flux and connect to an i...
| Main Authors: | , , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | en_US |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE)
2012
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| Online Access: | http://hdl.handle.net/1721.1/73149 https://orcid.org/0000-0002-6846-152X |