Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings
Characterizing the residual stress of thick nanocrystalline electrodeposits poses several unique challenges due to their fine grain structure, thickness distribution, and matte surface. We use a three-dimensional profilometry-based approach that addresses each of these complicating factors and enabl...
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| Інші автори: | |
| Формат: | Стаття |
| Мова: | en_US |
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Cambridge University Press (Materials Research Society)
2013
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| Онлайн доступ: | http://hdl.handle.net/1721.1/79788 https://orcid.org/0000-0001-9856-2682 |
| _version_ | 1826213637839126528 |
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| author | Ziebell, Tiffany D. Schuh, Christopher A. |
| author2 | Massachusetts Institute of Technology. Department of Materials Science and Engineering |
| author_facet | Massachusetts Institute of Technology. Department of Materials Science and Engineering Ziebell, Tiffany D. Schuh, Christopher A. |
| author_sort | Ziebell, Tiffany D. |
| collection | MIT |
| description | Characterizing the residual stress of thick nanocrystalline electrodeposits poses several unique challenges due to their fine grain structure, thickness distribution, and matte surface. We use a three-dimensional profilometry-based approach that addresses each of these complicating factors and enables quantitative analysis of residual stress with reasonable accuracy. The specific emphasis of this work is on thick (10–100 μm), nanocrystalline Ni-W electrodeposits of the finest grain sizes (4–63 nm), in which residual stresses arise during the deposition process as well as during postdeposition annealing. The present measurements offer quantitative insight into the mechanisms of stress development and evolution in these alloys, suggesting that the grain boundary structure is out of equilibrium (unrelaxed) and contains the excess free volume that controls the resulting residual stress levels in these films. There are apparently two factors contributing to this stress: the percentage of excess free volume contained in the grain boundaries, which is affected by the processing conditions, and the total volume fraction of grain boundaries, which is controlled by the grain size. |
| first_indexed | 2024-09-23T15:52:26Z |
| format | Article |
| id | mit-1721.1/79788 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T15:52:26Z |
| publishDate | 2013 |
| publisher | Cambridge University Press (Materials Research Society) |
| record_format | dspace |
| spelling | mit-1721.1/797882022-09-29T16:42:59Z Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings Ziebell, Tiffany D. Schuh, Christopher A. Massachusetts Institute of Technology. Department of Materials Science and Engineering Ziebell, Tiffany D. Schuh, Christopher A. Characterizing the residual stress of thick nanocrystalline electrodeposits poses several unique challenges due to their fine grain structure, thickness distribution, and matte surface. We use a three-dimensional profilometry-based approach that addresses each of these complicating factors and enables quantitative analysis of residual stress with reasonable accuracy. The specific emphasis of this work is on thick (10–100 μm), nanocrystalline Ni-W electrodeposits of the finest grain sizes (4–63 nm), in which residual stresses arise during the deposition process as well as during postdeposition annealing. The present measurements offer quantitative insight into the mechanisms of stress development and evolution in these alloys, suggesting that the grain boundary structure is out of equilibrium (unrelaxed) and contains the excess free volume that controls the resulting residual stress levels in these films. There are apparently two factors contributing to this stress: the percentage of excess free volume contained in the grain boundaries, which is affected by the processing conditions, and the total volume fraction of grain boundaries, which is controlled by the grain size. National Science Foundation (U.S.) (Grant DMI-0620304) American Society for Engineering Education. National Defense Science and Engineering Graduate Fellowship United States. Air Force Office of Scientific Research National Science Foundation (U.S.). Graduate Research Fellowship Program 2013-08-05T18:16:51Z 2013-08-05T18:16:51Z 2012-03 2011-09 Article http://purl.org/eprint/type/JournalArticle 0884-2914 2044-5326 http://hdl.handle.net/1721.1/79788 Ziebell, Tiffany D., and Christopher A. Schuh. “Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings.” Journal of Materials Research 27, no. 09 (May 13, 2012): 1271-1284. © Materials Research Society 2012 https://orcid.org/0000-0001-9856-2682 en_US http://dx.doi.org/10.1557/jmr.2012.51 Journal of Materials Research Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. application/pdf Cambridge University Press (Materials Research Society) MIT web domain |
| spellingShingle | Ziebell, Tiffany D. Schuh, Christopher A. Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings |
| title | Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings |
| title_full | Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings |
| title_fullStr | Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings |
| title_full_unstemmed | Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings |
| title_short | Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings |
| title_sort | residual stress in electrodeposited nanocrystalline nickel tungsten coatings |
| url | http://hdl.handle.net/1721.1/79788 https://orcid.org/0000-0001-9856-2682 |
| work_keys_str_mv | AT ziebelltiffanyd residualstressinelectrodepositednanocrystallinenickeltungstencoatings AT schuhchristophera residualstressinelectrodepositednanocrystallinenickeltungstencoatings |