Characterization and modeling of pattern dependencies in copper interconnects for integrated circuits
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2002.
Main Author: | Park, Tae Hong, 1973- |
---|---|
Other Authors: | Duane S. Boning. |
Format: | Thesis |
Language: | eng |
Published: |
Massachusetts Institute of Technology
2005
|
Subjects: | |
Online Access: | http://hdl.handle.net/1721.1/8082 |
Similar Items
-
Framework for characterization of copper interconnect in damascene CMP processes
by: Park, Tae Hong, 1973-
Published: (2009) -
Characterization and modeling of plasma etch pattern dependencies in integrated circuits
by: Abrokwah, Kwaku O
Published: (2007) -
Reliability of copper interconnects in integrated circuits
by: Choi, Zung-Sun
Published: (2008) -
Characterization of bonded copper interconnects for three-dimensional integrated circuits
by: Tadepalli, Rajappa, 1979-
Published: (2005) -
Investigating thermal dependence on monolithically-integrated photonic interconnects
by: Chen, Yu-Hsin, Ph. D. Massachusetts Institute of Technology
Published: (2013)