Decoupling bulk- and surface-limited lifetimes in thin kerfless silicon wafers using spectrally resolved transient absorption pump-probe spectroscopy and computer simulations

Decoupling bulk- and surface-limited lifetimes in thin kerfless silicon wafers using spectrally resolved transient absorption pump-probe spectroscopy and computer simulations

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.

Bibliographic Details
Main Author: Siah, Sin Cheng
Other Authors: Tonio Buonassisi.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2013
Subjects:
Mechanical Engineering.
Online Access:http://hdl.handle.net/1721.1/82298

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