Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, Februaru 2002.
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Format: | Thesis |
Language: | eng |
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Massachusetts Institute of Technology
2005
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Online Access: | http://hdl.handle.net/1721.1/8368 |