Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration

Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, Februaru 2002.

Bibliographic Details
Main Author:	Barkley, Edward Robert, 1977-
Other Authors:	Clifton G. Fonstad, Jr.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2005
Subjects:	Electrical Engineering and Computer Science.
Online Access:	http://hdl.handle.net/1721.1/8368

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