Integration of silicon photonics into electronic processes
Front-end monolithic integration has enabled photonic devices to be fabricated in bulk and thin-SOI CMOS as well as DRAM electronics processes. Utilizing the CMOS generic process model, integration was accomplished on multi-project wafers that were shared by standard electronic customers without req...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | en_US |
| Published: |
Society of Photo-Optical Instrumentation Engineers (SPIE)
2015
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| Online Access: | http://hdl.handle.net/1721.1/92731 https://orcid.org/0000-0003-0420-2235 |