Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations

The thermal interface conductance between Al and Si was simulated by a non-equilibrium molecular dynamics method. In the simulations, the coupling between electrons and phonons in Al are considered by using a stochastic force. The results show the size dependence of the interface thermal conductance...

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Bibliographic Details
Main Authors: Yang, Nuo, Luo, Tengfei, Esfarjani, Keivan, Henry, Asegun, Tian, Zhiting, Shiomi, Junichiro, Chalopin, Yann, Li, Baowen, Chen, Gang
Other Authors: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Article
Language:en_US
Published: American Scientific Publishers 2015
Online Access:http://hdl.handle.net/1721.1/97396
https://orcid.org/0000-0002-3968-8530