The Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishing
In chemical-mechanical polishing (CMP), surface asperities of the polishing pad play a key role, for they transmit normal force and impart tangential motion to the hard, nano-scale abrasive particles in the slurry. It has been shown recently, however, that the soft pad asperities themselves often ge...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | en_US |
| Published: |
Elsevier
2015
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| Online Access: | http://hdl.handle.net/1721.1/97402 https://orcid.org/0000-0002-8480-5572 https://orcid.org/0000-0002-3548-6173 https://orcid.org/0000-0003-1607-3581 |