The Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishing
In chemical-mechanical polishing (CMP), surface asperities of the polishing pad play a key role, for they transmit normal force and impart tangential motion to the hard, nano-scale abrasive particles in the slurry. It has been shown recently, however, that the soft pad asperities themselves often ge...
| Главные авторы: | , , |
|---|---|
| Другие авторы: | |
| Формат: | Статья |
| Язык: | en_US |
| Опубликовано: |
Elsevier
2015
|
| Online-ссылка: | http://hdl.handle.net/1721.1/97402 https://orcid.org/0000-0002-8480-5572 https://orcid.org/0000-0002-3548-6173 https://orcid.org/0000-0003-1607-3581 |