Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP)

Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2015.

Bibliographic Details
Main Author:	Johnson, Joy Marie
Other Authors:	Duane S. Boning.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2015
Subjects:	Electrical Engineering and Computer Science.
Online Access:	http://hdl.handle.net/1721.1/99832

Internet

http://hdl.handle.net/1721.1/99832