Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP)
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2015.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2015
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| Online Access: | http://hdl.handle.net/1721.1/99832 |
| _version_ | 1826202164450557952 |
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| author | Johnson, Joy Marie |
| author2 | Duane S. Boning. |
| author_facet | Duane S. Boning. Johnson, Joy Marie |
| author_sort | Johnson, Joy Marie |
| collection | MIT |
| description | Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2015. |
| first_indexed | 2024-09-23T12:03:31Z |
| format | Thesis |
| id | mit-1721.1/99832 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T12:03:31Z |
| publishDate | 2015 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/998322019-04-11T12:57:44Z Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) Johnson, Joy Marie Duane S. Boning. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. Electrical Engineering and Computer Science. Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2015. Cataloged from PDF version of thesis. Includes bibliographical references (pages 177-188). A theoretical modeling approach is developed to predict silica-specific instability in chemical-mechanical polishing (CMP) slurries. In CMP, the formation of large agglomerates is of great concern, as these large particles are associated with high defectivity and poor polishing performance. The proposed model describes the complex CMP slurry system as a colloid under high non-linear shear conditions. The model diverges from the classic colloidal models by focusing on the following: reaction limited agglomeration (RLA) bounded by silica-specific modes of transitory bonding, and modified DVLO assumptions to include chemical activation and hydrodynamic agglomerate break-up condition evaluation. In order to build physical intuition and predict key model parameters, fundamental studies and novel metrology of agglomerates is performed. by Joy Marie Johnson. Ph. D. 2015-11-09T19:51:44Z 2015-11-09T19:51:44Z 2015 2015 Thesis http://hdl.handle.net/1721.1/99832 927405078 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 188 pages application/pdf Massachusetts Institute of Technology |
| spellingShingle | Electrical Engineering and Computer Science. Johnson, Joy Marie Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) |
| title | Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) |
| title_full | Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) |
| title_fullStr | Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) |
| title_full_unstemmed | Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) |
| title_short | Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) |
| title_sort | slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization cmp |
| topic | Electrical Engineering and Computer Science. |
| url | http://hdl.handle.net/1721.1/99832 |
| work_keys_str_mv | AT johnsonjoymarie slurryabrasiveparticleagglomerationexperimentationandmodelingforchemicalmechanicalplanarizationcmp |