Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP)

Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP)

Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2015.

Bibliographic Details
Main Author: Johnson, Joy Marie
Other Authors: Duane S. Boning.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2015
Subjects:
Electrical Engineering and Computer Science.
Online Access:http://hdl.handle.net/1721.1/99832

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