Effect of linewidth scaling on hydrostatic stress in passivated interconnects

Effect of linewidth scaling on hydrostatic stress in passivated interconnects

In this study, numerical work using ANSYS and analytical work based on Eshelby models are performed to examine the effect of linewidth scaling on the hydrostatic stress in passivated metal interconnects. Aluminium and copper interconnects of thickness 1 micron and linewidth ranging from 10 nanomete...

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Bibliographic Details
Main Authors: Ang, Derrick, Ramanujan, Raju V.
Other Authors: School of Materials Science & Engineering
Format: Conference Paper
Language:English
Published: 2011
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
DRNTU::Engineering::Materials::Material testing and characterization
Online Access:https://hdl.handle.net/10356/100760
http://hdl.handle.net/10220/7303

Internet

https://hdl.handle.net/10356/100760
http://hdl.handle.net/10220/7303

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