Wafer level silicon mould fabrication and imprinting of high density microstructures

Wafer level mould fabrication and its imprinting technology are of great interest for cost effective mass fabrication of nano or microsized patterns. Although the process for making a silicon mould involves only several steps such as photolithography, deep reactive ion etching (DRIE) and nanoimprint...

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Bibliographic Details
Main Authors: Wong, T. I., Ong, H. Y., Lu, H. J., Tse, M. S., Quan, C. G., Ng, S. H., Zhou, X.
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/101184
http://hdl.handle.net/10220/16751