Thermal analysis of high-powered devices using analytical and experimental methods

Thermal characterization of high power microwave devices is important for determining their reliability. Exceeding the optimal temperature will have a detrimental effect on the performance and reliability of these devices. An accurate closed form analytical solution for predicting the channel temper...

Full description

Bibliographic Details
Main Authors: Ling, Joyce H. L., Tay, Andrew A. O., Choo, Kok Fah
Other Authors: International Conference on Electronic Packaging Technology and High Density Packaging (13th : 2012 : Guilin)
Format: Conference Paper
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/101339
http://hdl.handle.net/10220/16272