Transient liquid phase Ag-based solder technology for high-temperature packaging applications
A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/102603 http://hdl.handle.net/10220/24294 |