Effects of temperature and voids on the interfacial fracture of Si/a-Si3 N4 bilayer systems

Effects of temperature and voids on the interfacial fracture of Si/a-Si3 N4 bilayer systems

This work studies the effects of temperature, voids at or near the interface on the interfacial fracture behavior, and mechanisms of the Si/a-Si3N4 bilayer systems via molecular dynamics simulations. Under mode I loading, at 300 K, the interfacial strength of the bilayer system without voids is ∼22....

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Bibliographic Details
Main Authors: Lin, Pamela, Babicheva, Rita I., Xue, Ming, Zhang, Hai Shu, Xu, Huan, Liu, Bo, Zhou, Kun
Other Authors: School of Mechanical and Aerospace Engineering
Format: Journal Article
Language:English
Published: 2015
Subjects:
DRNTU::Science::Chemistry::Physical chemistry::Molecular structure and bonding
Online Access:https://hdl.handle.net/10356/103431
http://hdl.handle.net/10220/25836

Internet

https://hdl.handle.net/10356/103431
http://hdl.handle.net/10220/25836

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