Robust electromigration reliability through engineering optimization

Robust electromigration reliability through engineering optimization

With complex process integration approach and severe fabrication limitations caused by introduction of new materials and diminishing process margins, there are mounting concerns with the increased failure rate at the early life cycle (e.g.<1 year operation) of product application known as infant...

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Bibliographic Details
Main Authors: Tee, Kheng Chok, Ee, Yong Chiang, Aubel, Oliver, Pey, Kin Leong, Ng, Wee Loon, Liu, Junfeng, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2014
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:https://hdl.handle.net/10356/103452
http://hdl.handle.net/10220/24506

Internet

https://hdl.handle.net/10356/103452
http://hdl.handle.net/10220/24506

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