Study of heat transfer enhancement surfaces generated by additive manufacturing techniques
Thermal management in electronic devices is becoming increasingly challenging due to the higher heat outputs from the increased packing density of transistors. Nucleate boiling has been shown to be an effective cooling scheme for high heat flux removal. In recent years, the use of commercial porous...
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| Format: | Thesis |
| Language: | English |
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2019
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| Online Access: | https://hdl.handle.net/10356/105249 http://hdl.handle.net/10220/47827 |