Direct Si-Si bonding through self-assembled monolayers
Currently, the most widely used bonding method is hydrophilic bonding of oxidized surfaces, which provides high bonding strength. The presence of oxide interface leads to high resistivity and limits the practical applications of bonded wafers. Therefore, oxides-free bonding is desired. It can be rea...
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| Format: | Student Research Poster |
| Language: | English |
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2016
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| Online Access: | https://hdl.handle.net/10356/107545 http://hdl.handle.net/10220/41629 |