A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing
The objective of this project is to simulate the stresses developed in the epoxy encapsulated dummy integrated circuit package during leadframe pull-out testing. Finite element analyses are utilized to simulate the stresses developed due to free and constrained displacement boundary conditions, the...
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| Format: | Thesis |
| Language: | English |
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2008
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| Online Access: | http://hdl.handle.net/10356/13412 |