To study and implement inkless binning : in semiconductor industry

This thesis introduces a wafer mapping based inkless binning process for wafer sorting to segregate and identify the electrical and functional good dies and reject dies and using the map to pick up the good dies in die attach operation in the semiconductor IC packaging industry.

Detalhes bibliográficos
Autor principal: Venkatachalam Valliappan
Outros Autores: Spedding, Trevor Allan
Formato: Tese
Idioma:English
Publicado em: 2008
Assuntos:
Acesso em linha:http://hdl.handle.net/10356/13444