Thermal stress analysis of electronic packaging components
The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints o...
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| Format: | Thesis |
| Language: | English |
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2008
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| Online Access: | http://hdl.handle.net/10356/13448 |