Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application

Recent development of higher power and higher speed in integrated circuits has led to a corresponding demand in improvement for dielectric substrate materials. Conventional Al2O3 system has probably reached its maximum possible performance, with AlN being a prospective alternative, due to its signif...

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Bibliographic Details
Main Author: Sun, Li Min.
Other Authors: Boey, Freddy Yin Chiang
Format: Thesis
Language:English
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/13469
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author Sun, Li Min.
author2 Boey, Freddy Yin Chiang
author_facet Boey, Freddy Yin Chiang
Sun, Li Min.
author_sort Sun, Li Min.
collection NTU
description Recent development of higher power and higher speed in integrated circuits has led to a corresponding demand in improvement for dielectric substrate materials. Conventional Al2O3 system has probably reached its maximum possible performance, with AlN being a prospective alternative, due to its significantly higher thermal conductivity and its matching thermal expansion coefficient with Silicon. The present study aims to produce an Al2O3 and AlN composite system to combine the properties of these two materials for use as a microelectronics material. A mixture of 80%Al2O3 and 20%AlN (by weight) powders has been mechanically alloyed, spray-dried and then plasma sprayed to result in a synthesized Al2O3/AlN composite powder system. Analysis using X-ray diffraction (XRD), scanning electron microscope (SEM) with Energy Dispersive X-ray Spectroscopy (EDX) showed that the Al2O3/AlN composite powder system was successfully produced, with both components evenly integrated at a micron scale.
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spelling ntu-10356/134692023-03-11T17:29:07Z Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application Sun, Li Min. Boey, Freddy Yin Chiang School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials Recent development of higher power and higher speed in integrated circuits has led to a corresponding demand in improvement for dielectric substrate materials. Conventional Al2O3 system has probably reached its maximum possible performance, with AlN being a prospective alternative, due to its significantly higher thermal conductivity and its matching thermal expansion coefficient with Silicon. The present study aims to produce an Al2O3 and AlN composite system to combine the properties of these two materials for use as a microelectronics material. A mixture of 80%Al2O3 and 20%AlN (by weight) powders has been mechanically alloyed, spray-dried and then plasma sprayed to result in a synthesized Al2O3/AlN composite powder system. Analysis using X-ray diffraction (XRD), scanning electron microscope (SEM) with Energy Dispersive X-ray Spectroscopy (EDX) showed that the Al2O3/AlN composite powder system was successfully produced, with both components evenly integrated at a micron scale. Master of Engineering (MPE) 2008-09-04T04:33:17Z 2008-10-20T08:19:39Z 2008-09-04T04:33:17Z 2008-10-20T08:19:39Z 1998 1998 Thesis http://hdl.handle.net/10356/13469 en 167 p. application/pdf
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Sun, Li Min.
Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application
title Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application
title_full Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application
title_fullStr Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application
title_full_unstemmed Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application
title_short Novel processes for an Al2O3/AlN composite system as dielectric substrate for microelectronics application
title_sort novel processes for an al2o3 aln composite system as dielectric substrate for microelectronics application
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
url http://hdl.handle.net/10356/13469
work_keys_str_mv AT sunlimin novelprocessesforanal2o3alncompositesystemasdielectricsubstrateformicroelectronicsapplication