Optimisation of silicon adhesive cure using differential scanning calorimetry analysis
Polymer curing is an essential part of electronic manufacturing process. Most electronic components are sensitive to prolong heat exposure and has negative performance impact. Often, non-value-added time is wasted in post-cooling the part to acceptable temperature before the next process. Thus, the...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/13488 |