Fracture properties of Sn-37Pb and Sn-3.5Ag solder joints
Surface mount technology has increasingly become the industry norm and slowly replaced the pin through hole technique. This preference has led to a demand for higher quality solder joints. Besides the traditional role as an electrical connection, the joint needs to be able to act as a load bearing e...
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| Άλλοι συγγραφείς: | |
| Μορφή: | Thesis |
| Γλώσσα: | English |
| Έκδοση: |
2008
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| Διαθέσιμο Online: | http://hdl.handle.net/10356/13538 |