Quantitative analysis of the mechanical and electrical properties of Cu-Cu bonds for three-dimensional integrated circuits (3D ICs)
The increasing complexity and the scaling down of feature sizes for devices have led to the increasing dominance of interconnect delays in determining integrated circuit performance. One promising solution is to stack devices vertically, commonly known as 3D ICs. Copper is an attractive candidate fo...
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| Format: | Abschlussarbeit |
| Sprache: | English |
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2008
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| Online Zugang: | https://hdl.handle.net/10356/13607 |