Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications

This report presents the research and characterization work during the final year project. The project focuses on the structural and electrical characterization of AlN/GaN/AlN (AGA) double-heterojunction high electron mobility (HEMT) heterostructures on SiC substrates, and simulation of AGA HEMTs as...

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Main Author: Chen, Kai
Other Authors: Radhakrishnan K
Format: Final Year Project (FYP)
Language:English
Published: Nanyang Technological University 2020
Subjects:
Online Access:https://hdl.handle.net/10356/139404
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author Chen, Kai
author2 Radhakrishnan K
author_facet Radhakrishnan K
Chen, Kai
author_sort Chen, Kai
collection NTU
description This report presents the research and characterization work during the final year project. The project focuses on the structural and electrical characterization of AlN/GaN/AlN (AGA) double-heterojunction high electron mobility (HEMT) heterostructures on SiC substrates, and simulation of AGA HEMTs as well as InAlGaN/GaN quaternary HEMTs. The simulation study was carried out by using the self-consistent 1D Schrodinger-Poisson program. The main aim of this work is to build material parameters of InxAlyGa1-x-yN barrier layer from the known binary nitrides and study two dimensional electron gas (2DEG) density as a function of InxAlyGa1-x-yN barrier thickness for InAlGaN/GaN based high electron mobility transistors (HEMTs). It was observed that the 2DEG density increases with increasing InAlGaN thickness. A sheet carrier density of 1.215×1013 cm-2 for a 10 nm quaternary barrier and 500 nm GaN was simulated, which is slightly lower than the reported results, indicating further optimization of the material database is required. Simulation studies were also conducted on AGA structures. The 2DEG density as a function of GaN channel and AlN barrier layer thicknesses for the different surface potential of GaN was studied. AlN barrier layer thickness was found to have a higher impact than GaN channel thickness on the 2DEG density. Further, lower surface potential resulted in higher 2DEG concentration. In addition to simulations, Characterization of AlN/GaN/AlN HEMTs was carried out, and, growth samples were analyzed by optical microscopy, atomic force microscopy, and Hall measurement system. Data from high-resolution X-ray diffraction was measured by the staff in the lab and analysed with help from the team. Smooth and crack-free surface of both AlN and GaN layers in AGA structures were characterized. The completed AGA structure show that 2DEG is developed at AlN/GaN heterointerface. As predicted in simulations, 2DEG density increased with increased barrier layer thickness. An optimized AGA structure with 2DEG density of 3.86 ×1013 cm-2 and with carrier mobility of 629 cm2/V.s was achieved. Matching of experimentally obtained 2DEG density values with simulated results showed that MBE grown AGA structures has a surface potential of 0.8 eV.
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spelling ntu-10356/1394042023-07-07T18:54:20Z Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications Chen, Kai Radhakrishnan K School of Electrical and Electronic Engineering Temasek Laboratories Dharmarasu Nethaji eradha@ntu.edu.sg Engineering::Electrical and electronic engineering This report presents the research and characterization work during the final year project. The project focuses on the structural and electrical characterization of AlN/GaN/AlN (AGA) double-heterojunction high electron mobility (HEMT) heterostructures on SiC substrates, and simulation of AGA HEMTs as well as InAlGaN/GaN quaternary HEMTs. The simulation study was carried out by using the self-consistent 1D Schrodinger-Poisson program. The main aim of this work is to build material parameters of InxAlyGa1-x-yN barrier layer from the known binary nitrides and study two dimensional electron gas (2DEG) density as a function of InxAlyGa1-x-yN barrier thickness for InAlGaN/GaN based high electron mobility transistors (HEMTs). It was observed that the 2DEG density increases with increasing InAlGaN thickness. A sheet carrier density of 1.215×1013 cm-2 for a 10 nm quaternary barrier and 500 nm GaN was simulated, which is slightly lower than the reported results, indicating further optimization of the material database is required. Simulation studies were also conducted on AGA structures. The 2DEG density as a function of GaN channel and AlN barrier layer thicknesses for the different surface potential of GaN was studied. AlN barrier layer thickness was found to have a higher impact than GaN channel thickness on the 2DEG density. Further, lower surface potential resulted in higher 2DEG concentration. In addition to simulations, Characterization of AlN/GaN/AlN HEMTs was carried out, and, growth samples were analyzed by optical microscopy, atomic force microscopy, and Hall measurement system. Data from high-resolution X-ray diffraction was measured by the staff in the lab and analysed with help from the team. Smooth and crack-free surface of both AlN and GaN layers in AGA structures were characterized. The completed AGA structure show that 2DEG is developed at AlN/GaN heterointerface. As predicted in simulations, 2DEG density increased with increased barrier layer thickness. An optimized AGA structure with 2DEG density of 3.86 ×1013 cm-2 and with carrier mobility of 629 cm2/V.s was achieved. Matching of experimentally obtained 2DEG density values with simulated results showed that MBE grown AGA structures has a surface potential of 0.8 eV. Bachelor of Engineering (Electrical and Electronic Engineering) 2020-05-19T06:36:51Z 2020-05-19T06:36:51Z 2020 Final Year Project (FYP) https://hdl.handle.net/10356/139404 en A2095-191 application/pdf Nanyang Technological University
spellingShingle Engineering::Electrical and electronic engineering
Chen, Kai
Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications
title Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications
title_full Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications
title_fullStr Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications
title_full_unstemmed Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications
title_short Structural and surface characterization of wide band gap semiconductors for high-speed transistor applications
title_sort structural and surface characterization of wide band gap semiconductors for high speed transistor applications
topic Engineering::Electrical and electronic engineering
url https://hdl.handle.net/10356/139404
work_keys_str_mv AT chenkai structuralandsurfacecharacterizationofwidebandgapsemiconductorsforhighspeedtransistorapplications