Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding
In the present study, diffusion bonding of two dissimilar materials TC6 and copper alloy was investigated in vacuum chamber by directly bonding and using Ni foil as interlayer. Interface quality of the joints was evaluated by mechanical property and microstructure. The maximum shear strength of dire...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2020
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/142150 |