Reliability study of copper wire bonding and through silicon via
Interconnects are necessary for the electrical connection of an integrated circuits (IC). Therefore, its quality and reliability are vitally important to ensure that a device is working as it is intendedly designed. The continued scaling of devices and the desire for higher functionality and capabil...
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| Format: | Thesis-Doctor of Philosophy |
| Language: | English |
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Nanyang Technological University
2020
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| Online Access: | https://hdl.handle.net/10356/142271 |