Uniform delayering of copper metallization
Integrated circuit chips of newer technology usually have a larger die size and an increase number of metallization. Hence, pure usage of polishing to remove the layers would induce severe edge rounding. An alternative method is proposed to decrease the polishing time for copper metallization remova...
| Principais autores: | , , , , |
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| Outros Autores: | |
| Formato: | Conference Paper |
| Idioma: | English |
| Publicado em: |
2020
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| Assuntos: | |
| Acesso em linha: | https://hdl.handle.net/10356/143510 |