Three-dimensional capacitor embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications
This paper demonstrates the successful integration of three-dimensional (3-D) metal-insulator-metal (MIM) capacitors embedded in fully-filled Cu TSVs with diameter of 10 and 20 μm. Their thermo-mechanical reliability has been studied with both physical characterizations and electrical characterizati...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2020
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/144083 |