Ultra-thin bulk silicon thinning of advanced microprocessors & graphics processors fabricated in Sub-20 nm technology
The continual advancement of integrated circuits has seen the relentless scaling of minimum dimensions for semiconductor devices. Consequently, the burgeoning complexity of process technology and devices fabricated has necessitated advancements in device characterisation all through the failure anal...
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| Format: | Thesis-Master by Research |
| Language: | English |
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Nanyang Technological University
2020
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| Online Access: | https://hdl.handle.net/10356/144132 |