Sample preparation for deprocessing of 3D multi-die stacked package

Sample preparation for deprocessing of 3D multi-die stacked package

3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100...

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Bibliographic Details
Main Authors: Kor, Katherine Hwee Boon, Liu, Q., Gan, Chee Lip
Other Authors: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Format: Conference Paper
Language:English
Published: 2020
Subjects:
Engineering::Materials
Deprocessing
3D Multi-die Stacked Packages
Online Access:https://hdl.handle.net/10356/144906

Internet

https://hdl.handle.net/10356/144906

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