Sample preparation for deprocessing of 3D multi-die stacked package
3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
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2020
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/144906 |
| _version_ | 1826124195655843840 |
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| author | Kor, Katherine Hwee Boon Liu, Q. Gan, Chee Lip |
| author2 | IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| author_facet | IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Kor, Katherine Hwee Boon Liu, Q. Gan, Chee Lip |
| author_sort | Kor, Katherine Hwee Boon |
| collection | NTU |
| description | 3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 µm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package. |
| first_indexed | 2024-10-01T06:16:47Z |
| format | Conference Paper |
| id | ntu-10356/144906 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:16:47Z |
| publishDate | 2020 |
| record_format | dspace |
| spelling | ntu-10356/1449062020-12-05T20:12:00Z Sample preparation for deprocessing of 3D multi-die stacked package Kor, Katherine Hwee Boon Liu, Q. Gan, Chee Lip IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Temasek Laboratories Engineering::Materials Deprocessing 3D Multi-die Stacked Packages 3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 µm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package. Accepted version 2020-12-03T01:22:54Z 2020-12-03T01:22:54Z 2020 Conference Paper Kor, K. H. B., Liu, Q., & Gan, C. L. (2020). Sample preparation for deprocessing of 3D multi-die stacked package. Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 1-6. doi:10.1109/IPFA49335.2020.9260707 978-1-7281-6169-3 https://hdl.handle.net/10356/144906 10.1109/IPFA49335.2020.9260707 1 6 en © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/IPFA49335.2020.9260707 application/pdf |
| spellingShingle | Engineering::Materials Deprocessing 3D Multi-die Stacked Packages Kor, Katherine Hwee Boon Liu, Q. Gan, Chee Lip Sample preparation for deprocessing of 3D multi-die stacked package |
| title | Sample preparation for deprocessing of 3D multi-die stacked package |
| title_full | Sample preparation for deprocessing of 3D multi-die stacked package |
| title_fullStr | Sample preparation for deprocessing of 3D multi-die stacked package |
| title_full_unstemmed | Sample preparation for deprocessing of 3D multi-die stacked package |
| title_short | Sample preparation for deprocessing of 3D multi-die stacked package |
| title_sort | sample preparation for deprocessing of 3d multi die stacked package |
| topic | Engineering::Materials Deprocessing 3D Multi-die Stacked Packages |
| url | https://hdl.handle.net/10356/144906 |
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